학술논문

Asymmetrically Recessed 50-nm Gate-Length Metamorphic High Electron-Mobility Transistor With Enhanced Gain Performance
Document Type
Periodical
Source
IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 29(1):4-7 Jan, 2008
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
HEMTs
MODFETs
Performance gain
Substrates
Frequency
Fabrication
Epitaxial layers
Indium gallium arsenide
Gallium arsenide
Output feedback
Electron beam lithography
high electron-mobility transistors (HEMTs)
maximum stable gain (MSG)
metamorphic HEMTs (MHEMTs)
submillimeter wave FETs
Language
ISSN
0741-3106
1558-0563
Abstract
We report the design, fabrication and characterization of ultrahigh gain metamorphic high electron-mobility transistors. In this letter, a high-yield 50-nm T-gate process was successfully developed and applied to epitaxial layers containing high indium mole fraction InGaAs channels grown on GaAs substrates. A unique gate recess process was adopted to significantly increase device gain by effectively suppressing output conductance and feedback capacitance. Coupled with extremely small $\hbox{10}\ \mu\hbox{m} \times \hbox{25}\ \mu\hbox{m}$ via holes on substrates thinned to 1 mil, we achieved a 13.5 dB maximum stable gain (MSG) at 110 GHz for a 30-$\mu\hbox{m}$ gate-width device. To our knowledge, this is the highest gain performance reported for microwave high electron-mobility transistor devices of similar gate periphery at this frequency, and equivalent circuit modeling indicates that this device will operate at frequencies beyond 300 GHz.