학술논문

Boron Electrical Activation in SOI Compared to Bulk Si Substrates
Document Type
Conference
Source
2007 Spanish Conference on Electron Devices Electron Devices, 2007 Spanish Conference on. :29-32 Jan, 2007
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Boron
Crystallization
Crystalline materials
Silicon on insulator technology
Acceleration
CMOS technology
Annealing
Helium
Fabrication
Analytical models
Diffusion
Electrical Activation
SOI
Language
ISSN
2163-4971
Abstract
We investigate the influence of the buried Si/SiO2 interface in Silicon-On-Insulator (SOI) substrates on B electrical activation by comparing experimental data and atomistic simulations in bulk Si and SOI materials. In crystalline Si, the effect of the Si/SiO2 interface on the formation of B clusters is practically negligible because they are formed rapidly and locally in the region with high B and Si interstitial concentrations. During post-implant anneal less diffusion occurs and a slight acceleration of B activation is observed, as the Si/SiO2 interface increases the removal of Si interstitials and facilitates B cluster dissolution. In pre-amorphized Si, B clusters form during the recrystallization of the pre-amorphized layer. Therefore, the effect of the Si/SiO2 interface is mainly related to its influence on end of range defect (EOR) evolution after regrowth which in turn affects B deactivation and subsequent reactivation. Our simulations show that slightly less B deactivation occurs in SOI compared to bulk Si samples since the Si/SiO2 interface accelerates EOR defect dissolution. The effect is more significant as EOR damage is closer to the Si/SiO2 interface compared to the distance from EOR damage to the silicon surface.