학술논문
A multichip package for high-speed logic die
Document Type
Periodical
Author
Source
IEEE Transactions on Components, Hybrids, and Manufacturing Technology IEEE Trans. Comp., Hybrids, Manufact. Technol. Components, Hybrids, and Manufacturing Technology, IEEE Transactions on. 16(1):67-73 Feb, 1993
Subject
Language
ISSN
0148-6411
1558-3082
1558-3082
Abstract
Multichip packaging is an idea that is receiving increasing attention as electronic equipment manufacturers drive toward smaller, faster products. By connecting several chips together in a single package, board size can be reduced by up to a factor of 10 or more, and signal propagation between chips can be up to three times faster. Even so, multichip modules will only be utilized where they are the least expensive method of achieving a desired outcome. The authors discuss the required methodology and infrastructure that was developed to design, fabricate, and test a cost-effective, high-density multichip module developed to accommodate six high-speed application-specific integrated circuit (ASIC) logic devices.ETX