학술논문

Simulation analysis of boron pocket deactivation in NMOS transistors with SPER junctions
Document Type
Conference
Source
Conference on Electron Devices, 2005 Spanish Electron devices Electron Devices, 2005 Spanish Conference on. :451-454 2005
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Analytical models
Boron
MOSFETs
Solids
Atomic layer deposition
Atomic measurements
Amorphous materials
Crystallization
Electrical resistance measurement
MOS devices
Language
ISSN
2163-4971
Abstract
We analyze the effects of junction formation by low-temperature solid phase epitaxial regrowth in NMOS transistors. Atomistic simulations indicate that the high concentration of Si interstitials associated with the end of range (EOR) defects favors the local formation of boron clusters just beyond the amorphous/crystalline interface, in agreement to sheet resistance measurements. Thus, EOR defects locally deactivate B in the NMOS pockets. These boron clusters start dissolution, and thus B reactivates, when the high Si interstitial supersaturation produced by the EOR defects decays close to the equilibrium value. This occurs when EOR defects dissolve or evolve to very stable configurations, such us dislocation loops.