학술논문

Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

Document Type

Conference

Author

Lehman, L.P.; Kinyanjui, R.K.; Wang, J.; Xing, Y.; Zavalij, L.; Borgesen, P.; Cotts, E.J.

Source

Proceedings Electronic Components and Technology, 2005. ECTC '05. Electronic components and technology Electronic Components and Technology Conference, 2005. Proceedings. 55th. :674-681 2005

Subject

Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Microstructure
Soldering
Lead
Environmentally friendly manufacturing techniques
Assembly
Testing
Life estimation
Intermetallic
Switches
Degradation

Language

ISSN

0569-5503
2377-5726

Online Access

Full Text (IEEE) Find it@PNU

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