학술논문

Optimal chip-package codesign for high-performance DSP
Document Type
Periodical
Source
IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 28(2):288-297 May, 2005
Subject
Components, Circuits, Devices and Systems
Digital signal processing chips
Bandwidth
Signal processing algorithms
Fast Fourier transforms
Digital signal processing
Memory management
Engines
Transistors
Appropriate technology
Radar applications
Chip-package codesign
fast Fourier transform (FFT)
seamless high off-chip connectivity (SHOCC)
Language
ISSN
1521-3323
1557-9980
Abstract
In high-performance DSP systems, the memory bandwidth can be improved using high-density interconnect technology and appropriate memory mapping. High-density MCM and flip-chip solder bump technology is used to achieve a system with an I/O bandwidth of 100 Gb/s/cm2 die. The use of DRAMs in these systems usually make the performance of these systems poor, and some algorithms make it difficult to fully utilize the available memory bandwidth. This paper presents the design of a fast Fourier transform (FFT) engine that gives SRAM-like performance in a DRAM-based system. It uses almost 100% of the available burst-mode memory bandwidth. This FFT engine can compute a million-point FFT in 1.31 ms at a sustained computation rate of 8.64 /spl times/ 10/sup 10/ floating-point operations per second (FLOPS). This is at least an order of magnitude better than conventional systems.