학술논문

Microstructural and performance implications of gold in Su-Ag-Cu-Sb interconnections
Document Type
Conference
Source
53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :809-815 2003
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Gold
Soldering
Environmentally friendly manufacturing techniques
Lead
Microstructure
Assembly
Intermetallic
Testing
Temperature
Ceramics
Language
ISSN
0569-5503