학술논문
Interface engineering for performance and reliability boosting of logic devices
Document Type
Conference
Author
Source
2024 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2024 IEEE International. :1-3 Jun, 2024
Subject
Language
ISSN
2380-6338
Abstract
As the width of interconnects scales down, it is getting more crucial to figure out and handle interfacial phenomena, which is called as interface engineering, to ensure device performance and reliability. In this study, we investigated various interactions among metal to metal and metal to dielectric interfaces in interconnect structure with regard to electrical characteristics related to resistance, capacitance, and reliability. As a result, it enabled to improve in resistance by 30% and capacitance by 5% via recently developed and optimized process conditions in sub-2nm logic devices.