학술논문

Efficient Investigation of Coupled Lines in Quasi Periodical High-Density Signal Routings for HPC Applications
Document Type
Conference
Source
2024 IEEE 28th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2024 IEEE 28th Workshop on. :1-4 May, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Couplings
Correlation
Conferences
Nonhomogeneous media
Conductors
Silicon
Polymers
HBM
Signal Integrity
cross talk
Interposer
Language
ISSN
2835-0898
Abstract
In this paper, a method for efficient and rigorous analysis of cross coupling in a very dense periodical arrangement of signal lines in re-distribution layers of silicon-based interposers is presented. The proposed method reduces the calculation in a complex multi-conductor and multilayer structure to a very small number of time-consuming field calculations. Some examples related to a polymer-based silicon interposer showing the nature of the aggressor's field propagation through neighboring traces depending on the position of the aggressor and victim conductors are presented. Very good correlation between the proposed method and commercial fields solvers such as CST are obtained.