학술논문
Design of novel ultrasound transducers compatible with large-area electronics
Document Type
Conference
Author
Source
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024
Subject
Language
ISSN
2833-8596
Abstract
This paper presents a proof-of-concept for manufacturing ultrasound transducers on top of a TFT switch matrix. The novel process incorporates a bonding step crucial for both mechanical and electrical connections between the PMUT frontplane and the TFT backplane. Considering this specific boundary condition, the PMUT device is designed to emit a maximum pressure generated by the PMUT membrane itself minimizing the effect of the crosstalk inter PMUT. Initial measurements are compared to simulation results, demonstrating good alignment. Additionally, the paper showcases an image generated by a PMUT array operating at 3MHz.