학술논문

Finite Element Analysis of the Effect of Semi-Die Angle During Drawing on the Properties of Bi-2223 Superconducting Wires
Document Type
Periodical
Source
IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(3):1-5 May, 2024
Subject
Fields, Waves and Electromagnetics
Engineered Materials, Dielectrics and Plasmas
Finite element analysis
Stress
Powders
Deformation
Wire drawing
Load modeling
Deformable models
Finite element methods
Bi-2223
drawing
semi-die angle
Language
ISSN
1051-8223
1558-2515
2378-7074
Abstract
Finite element Modelling (FEM) using ABAQUS was employed to study the effect of semi-die angle during drawing process on associated properties of Bi-2223 wires. FEM models for deformation of monofilamentary and multifilamentary wire were developed. The powder density, stress distribution during deformation, equivalent plastic strain after deformation was calculated by FEM and used to analyze experimental results on the densification state, drawing force, wire structure and hardness distribution in Bi-2223 wires. It is suggested that smaller semi-die angle of 6° results in larger axial tensile load during drawing but provides better radial homogeneity, a larger semi-die angle of 14° provides higher radial pressure but increases the risk of internal breakage of the Ag matrix due to stress concentration.