학술논문
Security Advantages and Challenges of 3D Heterogeneous Integration
Document Type
Periodical
Author
Source
Computer. 57(3):107-112 Mar, 2024
Subject
Language
ISSN
0018-9162
1558-0814
1558-0814
Abstract
Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.