학술논문

Electro-thermal analysis of Phase Change Memory Devices for Synaptic Applications
Document Type
Conference
Source
2023 IEEE 20th India Council International Conference (INDICON) India Council International Conference (INDICON), 2023 IEEE 20th. :621-625 Dec, 2023
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Fields, Waves and Electromagnetics
General Topics for Engineers
Geoscience
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Phase change materials
Neuromorphic engineering
Voltage
Phase change memory
Finite element analysis
Thermoelectricity
Synapses
Phase change modeling
Finite-element analysis
Spike-timing dependent plasticity (STDP)
Artificial synapse
Language
ISSN
2325-9418
Abstract
In this work, we present the impact of electro-thermal analysis on Phase change memory (PCM) devices to mimic the bio-inspired neuron-synaptic applications, particularly crucial for implementing neuromorphic devices. A 2-D finite element simulation with axis symmetry is employed to analyze the electro-thermal effect on the PCM device using Ge 2 Sb 2 Te 5 (GST) as a phase change material. The thermoelectric effects at the inside GST are calculated using the material with temperature-dependent features. A substantial increase in temperature profile (548.7K-1294.8K) within the GST is achieved with RESET pulses varying from (2V-4V). Hence, the formation of the amorphous cap thickness (A T ), an utmost desire to achieve the change in conductance inside the device, is suitable to emulate the biological brain. There is a 26% increase in A T realized with the applications of consecutive voltage pulses, while a ~20% decrease in conductance value is witnessed in response to the growth of A T .