학술논문

Preparation of Large Grain Size Polysilicon Using Long-Pulse Green Laser Annealing for 3-D Integration Technology
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(3):1957-1962 Mar, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Grain size
Crystallization
Films
Annealing
Chemical lasers
Lasers
Thin film transistors
Grain boundary
grain filter (GF)
grain size
integrity
single grain
thin-film transistors (TFTs)
Language
ISSN
0018-9383
1557-9646
Abstract
Location-controlled single grains were obtai- ned through amorphous silicon grown on substrates embedded with microstructure called grain filters (GFs) using long-pulse green laser annealing. This work demonstrates the significant influence of GF spacing and size on grain quality. Accomplished results in this work evidenced that defects like grain boundary could be decreased by manipulating the GF spacing and dimensions to achieve high-integrity single grains with large grain sizes, which is beneficial for device fabrication. Thin-film transistors (TFTs) (W/L = 0.18/ $0.22~\mu \text{m}$ ) fabricated on the grains under optimized conditions exhibit excellent electrical performance, with an extracted field-effect mobility of 336 cm2/V-s and an exceptional ${I}_{\text {on}}/{I}_{\text {off}}$ ratio of $5.16\times 10^{{6}}$ .