학술논문

Impact of Process-Induced Inclined Side-Walls on Gate Leakage Current of Nanowire GAA MOSFETs
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(3):2196-2202 Mar, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Logic gates
MOSFET
Gallium arsenide
Semiconductor device modeling
Gate leakage
Fabrication
Voltage measurement
gate-all-around metal–oxide semiconductor field-effect transistor (GAA MOSFET)
measurement
overlap
trapezoidal (Tz) cross section
underlap
Language
ISSN
0018-9383
1557-9646
Abstract
In this work, the influence of process-induced sidewall inclination on direct tunneling gate leakage current ( ${I}_{G}$ ) in the trapezoidal (Tz) channel NW GAA MOSFETs has been comprehensively investigated using experimental data and the TCAD simulations results. Variability in device parameters as channel length, height, and width have been taken into account when we examined gate leakage current. The side-wall inclination angle has a significant influence on the gate leakage current, where a rise in ${I}_{G}$ of up to two times is observed when the inclination angle is increased from 0° to 20°. Moreover, it has also been observed that the direct tunneling gate leakage current is significantly influenced by the gate overlap and underlap areas.