학술논문

Electrothermal Effects on Hot Carrier Injection Reliability of n-Type FinFETs in Ring Oscillators
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(2):1191-1198 Feb, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
FinFETs
Layout
Heating systems
Stress
TV
Human computer interaction
Transient analysis
Electrothermal simulation
FinFET
FreePDK15
hot carrier injection (HCI)
ring oscillator (RO)
self-heating effect
threshold voltage shift (TVS)
Language
ISSN
0018-9383
1557-9646
Abstract
The hot carrier injection (HCI) reliability of n-type FinFETs in ring oscillators (ROs) is investigated with consideration of the circuit-level time-varying electrothermal effects in the ROs. The oscillating voltages and electrical power in a nine-stage RO are captured by circuit simulation in Cadence with its layout that is designed and verified based on FreePDK15. Spatial temperature response is obtained by heat conduction simulation with finite element analysis in the 3-D integrated structure that is accordingly constructed from the layout of the RO, where the heat generation is extracted from the Cadence simulation. With the obtained ac stress voltages and transient temperature, the HCI-induced threshold voltage shift (TVS) of n-type FinFETs under the circuit-level time-varying electrothermal effects is successfully predicted. The impacts of electrical and thermal parameters of the RO, including the supply voltage and thermal surrounding, on the electrothermal response and HCI reliability of FinFETs are also revealed.