학술논문

Multilayer Packaged Single- and Dual-Band Dual-Channel Bandpass Filters Based on Substrate Integrated Waveguide Cavities
Document Type
Periodical
Source
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(1):114-121 Jan, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Dual band
Resonators
Filtering
Substrates
Resonant frequency
Band-pass filters
Substrate integrated waveguides
Bandpass filter (BPF)
dual-channel
isolation
multilayer
orthogonal degenerate mode
substrate integrated waveguide (SIW)
Language
ISSN
2156-3950
2156-3985
Abstract
This article presents a design method for multilayer packaged single- and dual-band dual-channel bandpass filters (DCBPFs) based on square substrate integrated waveguide (SIW) cavities. By exploiting one or multiple pairs of orthogonal degenerate modes in square SIW resonators, two single-band and one dual-band DCBPFs with high channel isolations are implemented. By arranging feeding ports and coupling apertures, a highly selective single-band DCBPF with multiple types of operating states is demonstrated. In order to construct a dual-band DCBPF design, balanced feeding ports are introduced to excite the operating modes and suppress unwanted spurious modes between the dual passbands, thus realizing a satisfactory dual-band frequency response. To validate the design method, two single-band and one dual-band prototypes are designed, fabricated, and measured. The results exhibit excellent filtering performance and high channel-to-channel isolations.