학술논문

AlGaN-Based Deep-Ultraviolet Light-Emitting Diodes With Varied Thickness of Sidewall Passivation via Atomic Layer Deposition
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(11):5727-5731 Nov, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Passivation
Light emitting diodes
Films
Radiative recombination
Atomic layer deposition
Wide band gap semiconductors
Aluminum gallium nitride
Atomic layer deposition (ALD)
deep-ultraviolet light-emitting diodes (DUV-LEDs)
sidewall passivation
Language
ISSN
0018-9383
1557-9646
Abstract
In this study, we fabricated deep-ultraviolet light-emitting diodes (DUV-LEDs) with Al2O3 films of 0-, 130-, and 255-nm via atomic layer deposition (ALD). In addition, the effects of the passivation layers on the DUV-LEDs were systematically investigated. The current–voltage characteristics of these samples revealed the passivating effect of the Al2O3 ALD films on the DUV-LEDs. By analyzing the external quantum efficiency (EQE) at room temperature using the ABC + ${f}\,{(n)}$ model, the differences in the physical mechanisms of the Al2O3 ALD film on DUV-LEDs were determined. The measurements of the electroluminescence (EL) and far-field radiation patterns (EQE, light output power (LOP), and radiation patterns) showed that ALD can enhance the performance of DUV-LEDs, particularly DUV-LEDs with a 130-nm Al2O3 ALD passivation layer. Moreover, the aging test and failure ratio of these DUV-LEDs under humidity exposure (85 °C/85% RH) indicated the specific effect of these Al2O3 ALD films on the reliability of DUV-LEDs.