학술논문
Use of Cavity Perturbation Techniques to Characterize Via-Plate Behavior
Document Type
Conference
Author
Source
2023 IEEE/MTT-S International Microwave Symposium - IMS 2023 Microwave Symposium - IMS 2023, 2023 IEEE/MTT-S International. :709-712 Jun, 2023
Subject
Language
ISSN
2576-7216
Abstract
This paper describes an analytical technique for characterization of a via-plate assembly using a short-circuited coaxial resonant structure. Calculated via-plate coaxial and barrel plate capacitance values are compared to results previously published.