학술논문

Precise VTH Control of MFSFET with 5 nm-thick FeND-HfO2 Realized by Kr-Plasma Sputtering for Pt Gate Electrode Deposition
Document Type
Conference
Source
2023 Device Research Conference (DRC) 2023 Device Research Conference (DRC), 2023. :1-2 Jun, 2023
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Electrodes
Zirconium
Logic gates
Threshold voltage
Plasmas
Hafnium compounds
Thermal analysis
Language
ISSN
2640-6853
Abstract
Ferroelectric HfO 2 (Fe-HfO 2 ) doped with Zr etc. is widely investigated for the metal-ferroelectrics-Si field-effect transistor (MFSFET) nonvolatile memory because of its Si compatibility [1], [2]. We have reported the MFSFET with ferroelectric nondoped HfO 2 (FeND-HfO2) to suppress the threshold voltage (V TH ) variation and decrease the thermal budget for analog memory application [3]–[5]. Although the MFSFET with 5 nm-thick FeND-HfO 2 was realized, the plasma damage is necessary to be decreased during the Pt gate electrode deposition [6]. In this paper, we have investigated the V TH control of MFSFET utilizing Kr-plasma sputtering for Pt gate electrode deposition on 5 nm-thick FeND-HfO 2 .