학술논문

Reliability of GaN MOSc-HEMTs: From TDDB to Threshold Voltage Instabilities (Invited)
Document Type
Conference
Source
2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-8 Mar, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Three-dimensional displays
Semiconductor device reliability
Logic gates
Threshold voltage
Silicon
Epitaxial growth
Topology
HV-BTI
TDDB
GaN MOSc-HEMT
Vth instability
GaN on Si
Language
ISSN
1938-1891
Abstract
In this paper, we review the gate reliability of the GaN MOSc-HEMT as well as the specific method to address the peculiarities of these transistors. The long term forward gate TDDB will be explored showing the impact of the gate recession and gate material on the expected maximum gate oxide field $(\mathbf{E_{OX, MAX}})$ at 10 years. The gate related threshold voltage instabilities (pBTI and nBTI) are reviewed showing the interplay between epitaxy material and gate oxide process. Finally, the high drain voltage influence on Vth (HVBTI) is studied through the development of specific and dedicated setup allowing a deeper understanding of the device instabilities during operation.