학술논문
Numerical Analysis of Thermal Runaway in Copper-Plated Multifilament Coated Conductor
Document Type
Periodical
Author
Source
IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-5 Aug, 2023
Subject
Language
ISSN
1051-8223
1558-2515
2378-7074
1558-2515
2378-7074
Abstract
We have developed a numerical analysis model to simulate the thermal runaway in copper-plated multifilament coated conductors. We combined a circuit model to calculate current distribution in filaments and copper and a two-dimensional heat conduction model to calculate temperature distribution. The thermal runaway simulations of multifilament coated conductor with local defects were performed, and compared with the experimental results to validate the developed model. According to the simulation results, the effect of current sharing on the initiation of thermal runaway was determined.