학술논문

Through the Looking Glass—The 2023 Edition: Trends in solid-state circuits from ISSCC
Document Type
Periodical
Source
IEEE Solid-State Circuits Magazine IEEE Solid-State Circuits Mag. Solid-State Circuits Magazine, IEEE. 15(1):45-62 Jan, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Aerospace
Computing and Processing
Fields, Waves and Electromagnetics
Geoscience
Robotics and Control Systems
Signal Processing and Analysis
Transportation
Communication, Networking and Broadcast Technologies
Power, Energy and Industry Applications
Integrated circuits
Technological innovation
Solid state circuit design
Market research
Language
ISSN
1943-0582
1943-0590
Abstract
The International Solid-State Circuits Conference (ISSCC) is the flagship conference of the IEEE Solid-State Circuits Society. The theme for ISSCC 2023 is “Building on 70 Years of Innovation in Solid-State Circuit Design.” The IC design community has proved to be agile and resilient in a world scarred by the worldwide pandemic, and this year’s ISSCC commemorates the 70th anniversary of ISSCC with an edition that is more than ever focused on innovation. To enhance our lives and support increasingly more innovative developments, ISSCC promotes and shares new circuit ideas with potential to advance the state of the art for IC design and enable systems with ever-improving functionality and efficiency.