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Growth kinetics of the intermetallic phase in diffusion-soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections

Document Type

Article

Author

Wierzbicka-Miernik, A.; Miernik, K.; Wojewoda-Budka, J.; Szyszkiewicz, K.; Filipek, R.; Litynska-Dobrzynska, L.; Kodentsov, A.; Zieba, P.

Source

In Materials Chemistry and Physics 15 November 2013 142(2-3):682-685

Subject

Language

ISSN

0254-0584

Online Access

Full Text (ScienceDirect) Web of Science JCR 저널정보 Scopus Find it@PNU

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