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Characterisation of the HEXITEC[formula omitted] X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology

Document Type

Article

Author

Veale, M.C.; Booker, P.; Church, I.; Jones, L.L.; Lipp, J.; Schneider, A.; Seller, P.; Wilson, M.D.; Chsherbakov, I.; Kolesnikova, I.; Lozinskaya, A.; Novikov, V.; Tolbanov, O.; Tyazhev, A.; Zarubin, A.

Source

In Nuclear Inst. and Methods in Physics Research, A 11 February 2022 1025

Subject

Language

ISSN

0168-9002

Online Access

Full Text (ScienceDirect 종량제) Web of Science JCR 저널정보 Scopus Find it@PNU

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