학술논문
Effect of interaction between dodecyltrimethylammonium chloride (DTAC) and bis(3-sulphopropyl) disulphide (SPS) on the morphology of electrodeposited copper
Document Type
Article
Author
Source
In Electrochimica Acta 1 September 2013 106:49-62
Subject
Language
ISSN
0013-4686