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Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging

Document Type

Journal

Author

Wadatsumi, Takuya; Kawai, Kohei; Hasegawa, Rikuu; Muramatsu, Kikuo; Hasegawa, Hiromu; Sawada, Takuya; Fukushima, Takahito; Kondo, Hisashi; Miki, Takuji; Nagata, Makoto

Source

IEICE TRANSACTIONS ON ELECTRONICS; OCT 2023, E106C 10, p556-p564, 9p.

Subject

Language

English

ISSN

17451353

Online Access

Open Access (JSTAGE) Web of Science Scopus Find it@PNU

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