학술논문
'학술논문'
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1~10
Academic Journal
Tajiri T; Suzuki M; Kutsuna T; Nishiyama H; Ito K; Takeda N; Fukumitsu K; Kanemitsu Y; Fukuda S; Umemura T; Ohkubo H; Maeno K; Ito Y; Oguri T; Takemura M; Yoshikawa K; Niimi A
Journal of Asthma and Allergy, Vol Volume 16, Pp 149-157 (2023)
Conference
2022 IEEE International Conference on Plasma Science (ICOPS) Plasma Science (ICOPS), 2022 IEEE International Conference on. :1-2 May, 2022
Academic Journal
Therapeutics and Clinical Risk Management, Vol 2012, Iss default, Pp 79-86 (2012)
Academic Journal
He, Feng; Antonucci, Laura; Yamachika, Shinichiro; Zhang, Zechuan; Taniguchi, Koji; Umemura, Atsushi; Hatzivassiliou, Georgia; Roose-Girma, Merone; Reina-Campos, Miguel; Duran, Angeles; Diaz-Meco, Maria T; Moscat, Jorge; Sun, Beicheng; Karin, Michael
Journal of Hepatology. 72(6)
Academic Journal
Angelopoulos, V; Cruce, P; Drozdov, A; Grimes, EW; Hatzigeorgiu, N; King, DA; Larson, D; Lewis, JW; McTiernan, JM; Roberts, DA; Russell, CL; Hori, T; Kasahara, Y; Kumamoto, A; Matsuoka, A; Miyashita, Y; Miyoshi, Y; Shinohara, I; Teramoto, M; Faden, JB; Halford, AJ; McCarthy, M; Millan, RM; Sample, JG; Smith, DM; Woodger, LA; Masson, A; Narock, AA; Asamura, K; Chang, TF; Chiang, C-Y; Kazama, Y; Keika, K; Matsuda, S; Segawa, T; Seki, K; Shoji, M; Tam, SWY; Umemura, N; Wang, B-J; Wang, S-Y; Redmon, R; Rodriguez, JV; Singer, HJ; Vandegriff, J; Abe, S; Nose, M; Shinbori, A; Tanaka, Y-M; UeNo, S; Andersson, L; Dunn, P; Fowler, C; Halekas, JS; Hara, T; Harada, Y; Lee, CO; Lillis, R; Mitchell, DL; Argall, MR; Bromund, K; Burch, JL; Cohen, IJ; Galloy, M; Giles, B; Jaynes, AN; Le Contel, O; Oka, M; Phan, TD; Walsh, BM; Westlake, J; Wilder, FD; Bale, SD; Livi, R; Pulupa, M; Whittlesey, P; DeWolfe, A; Harter, B; Lucas, E; Auster, U; Bonnell, JW; Cully, CM; Donovan, E; Ergun, RE; Frey, HU; Jackel, B; Keiling, A; Korth, H; McFadden, JP; Nishimura, Y; Plaschke, F; Robert, P; Turner, DL; Weygand, JM; Candey, RM; Johnson, RC; Kovalick, T; Liu, MH; McGuire, RE; Breneman, A
Space science reviews. 215(1)
Conference
2010 IEEE International Symposium on Electrical Insulation Electrical Insulation (ISEI), Conference Record of the 2010 IEEE International Symposium on. :1-4 Jun, 2010
Conference
Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials (Cat. No.03CH37417) Properties and applications of dielectric materials Properties and Applications of Dielectric Materials, 2003. Proceedings of the 7th International Conference on. 3:944-948 vol.3 2003
Academic Journal
Varela, L. B.; Umemura, M. T.; Calderón-Hernández, J. W.; Pinedo, C. E.; Kolawole, F. O.; Tschiptschin, A. P.
Materials Performance and Characterization, Mar 2021, Vol. 10, No. 1, pp. 181-188.
Conference
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :135-140 2000
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[Author] Umemura T
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