학술논문
'학술논문'
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IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 8(8):1-4 Aug, 2024
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Leung, C. H.; Nagai, K.; Nakano, K.; Nawarathne, D.; Dove, J.; Prasad, S.; Wuerfel, N.; Aidala, C. A.; Arrington, J.; Ayuso, C.; Barker, C. L.; Brown, C. N.; Chang, W. C.; Chen, A.; Christian, D. C.; Dannowitz, B. P.; Daugherity, M.; Fassi, L. El; Geesaman, D. F.; Gilman, R.; Goto, Y.; Guo, R.; Hague, T. J.; Holt, R. J.; Hossain, M. F.; Isenhower, D.; Kinney, E.; Klein, A.; Kleinjan, D. W.; Kudo, Y.; Lin, P. -J.; Liu, K.; Liu, M. X.; Lorenzon, W.; McClellan, R. E.; McGaughey, P. L.; Medeiros, M. M.; Miyachi, Y.; Miyasaka, S.; Morton, D. H.; Nakahara, K.; Nara, S.; Pate, S. F.; Peng, J. C.; Pun, A.; Ramson, B. J.; Reimer, P. E.; Rubin, J. G.; Sanftl, F.; Sawada, S.; Sawada, T.; Scott, M. B. C.; Shibata, T. -A.; Tadepalli, A. S.; Teo, M.; Towell, R. S.; Uemura, S.; Wang, S. G.; Wickes, A. B.; Wu, J.; Ye, Z. H.
Phys. Lett. B 858, 139032 (2024)
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):240-250 Feb, 2024
Academic Journal
Huang, C.; Nihey, F.; Inai, T.; Kobayashi, Y.; Fujita, K.; Yamamoto, A.; Fujimoto, M.; Fukushi, K.; Nakahara, K.
IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 73:1-12 2024
Academic Journal
IEEE Access Access, IEEE. 12:86886-86895 2024
Academic Journal
IEEE Sensors Letters IEEE Sens. Lett. Sensors Letters, IEEE. 7(8):1-4 Aug, 2023
Academic Journal
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(9):4743-4748 Sep, 2023
Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism
Academic Journal
Experimental Techniques: Developments, Applications and Tutorials in Experimental Mechanics and Dynamics. 48(3):399-408
Academic Journal
IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(8):8839-8855 Apr, 2023
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):197-210 Feb, 2023
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[Author] Nakahara K
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