학술논문
'학술논문'
에서 검색결과 51건 | 목록
1~10
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):593-600 Apr, 2024
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):240-250 Feb, 2024
Nine Point Bending Test Technique for Understanding of Sintered Silver Die Bonding Failure Mechanism
Academic Journal
In: Experimental Techniques . (Experimental Techniques, June 2024, 48(3):399-408)
Academic Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(2):197-210 Feb, 2023
Academic Journal
In: Microelectronics Reliability . (Microelectronics Reliability, February 2024, 153)
Academic Journal
In: Journal of Japan Institute of Electronics Packaging . (Journal of Japan Institute of Electronics Packaging, 2023, 26(5):448-453)
Academic Journal
In: Japanese Journal of Applied Physics . (Japanese Journal of Applied Physics, June 2022, 61(SD))
Conference
Hayashi, K.; Tanikawa, K.; Sato, O.; Ishibashi, T.; Hayashiguchi, M.; Otsuka, T.; Wakamoto, K.; Noma, T.; Mostafa, N.; Felipe, F.
In: ETG-Fachbericht , CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems. (ETG-Fachbericht, 2024, 173:588-591)
Academic Journal
In: Energies . (Energies, September 2021, 14(17))
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제한된 항목
[AR] Wakamoto, K.
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