학술논문
'학술논문'
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1~10
Academic Journal
Javadi, Yashar; MacLeod, Charles N.; Pierce, Stephen G.; Gachagan, Anthony; Lines, David; Mineo, Carmelo; Ding, Jialuo; Williams, Stewart; Vasilev, Momchil; Mohseni, Ehsan; Su, Riliang
In Additive Manufacturing October 2019 29
Academic Journal
Yang, Nan; Ma, Ke; Liu, Weidong; Zhang, Ning; Shi, Zhouhua; Ren, Jian; Xu, Wanli; Li, Yuqiu; Su, Riliang; Liang, Yanbo; Wang, Shijun; Li, Xiuyang
Biomedical Chromatography; Oct2023, Vol. 37 Issue 10, p1-14, 14p
Conference
Kang, Lei; Feeney, Andrew; Somerset, Will; Su, Riliang; Lines, David; Ramadas, Sivaram Nishal; Dixon, Steve
2019 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2019 IEEE International. :1590-1593 Oct, 2019
Conference
Mineo, Carmelo; MacLeod, Charles; Su, Riliang; Lines, Dave; Davi, Santi; Cowan, Bruce; Pierce, S. Gareth; Paton, Scott; Munro, Gavin; McCubbin, Coreen; Watson, David; Kerr, William; Millar, Richard
2019 IEEE 5th International Workshop on Metrology for AeroSpace (MetroAeroSpace) Metrology for AeroSpace (MetroAeroSpace), 2019 IEEE 5th International Workshop on. :82-86 Jun, 2019
Conference
Jager, Axel; Unger, Alexander; Wang, Han; Arnaudov, Yavor; Kang, Lei; Su, Riliang; Lines, Dave; Ramadas, Sivaram Nishal; Dixon, Steve; Kupnik, Mario
2017 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2017 IEEE International. :1-4 Sep, 2017
Conference
Kang, Lei; Feeney, Andrew; Su, Riliang; Lines, David; Jager, Axel; Wang, Han; Arnaudov, Yavor; Ramadas, Sivaram Nishal; Kupnik, Mario; Dixon, Steve
2017 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2017 IEEE International. :1-4 Sep, 2017
Conference
Kang, Lei; Eriksson, Tobias; Ramadas, Sivaram Nishal; Su, Riliang; Lines, David; Kupnik, Mario; Dixon, Steve
2016 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2016 IEEE International. :1-4 Sep, 2016
Conference
2013 Far East Forum on Nondestructive Evaluation/Testing: New Technology and Application Nondestructive Evaluation/Testing: New Technology & Application (FENDT), 2013 Far East Forum on. :150-154 Jun, 2013
Academic Journal
Academic Journal
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