학술논문
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Mohanty, Nihar; Altamirano-Sánchez, Efrain; Sarkar, T.; Radisic, D.; Vega Gonzalez, V.; Stiers, K.; Sheng, C.; Montero, D.; Jenkins, H.; Demand, M.; Wang, P.; Lazzarino, F.; Horiguchi, N.
Proceedings of SPIE; April 2024, Vol. 12958 Issue: 1 p129580B-129580B-9, 1166230p
Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Conference
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :107-110 Nov, 2016
Conference
Demuynck, S.; Gonzalez, V.V.; De Carvalho Cavalcante, C.T.; Lima, L.P.B.; Stiers, K.; Sheng, C.; Vandooren, A.; Hosseini, M.; Zhou, X.; Mertens, H.; Chiarella, T.; Bommels, J.; Loo, R.; Rosseel, E.; Porret, C.; Shimura, Y.; Akula, A.; Mannaert, G.; Choudhury, S.; Brissonneau, V.; Dupuy, E.; Sarkar, T.; Vergel, N.F.; Peter, A.; Jourdan, N.; Soulie, J.P.; Vandersmissen, K.; Sebaai, F.; Gowda, P.P.; Lai, K.; Mingardi, A.; Sarkar, S.S.; Dhave, K.; Chan, B.T.; Marquez, A.S.; Langer, R.; Koo, I.G.; Sanchez, E.A.; Devriendt, K.; Delgadillo, P.R.; Lazzarino, F.; Mitard, J.; Geypen, J.; Grieten, E.; Batuk, D.; Chen, Y.-F.; Verbeek, F.; Holsteyns, F.; Subramanian, S.; Horiguchi, N.; Biesemans, S.
In: Digest of Technical Papers - Symposium on VLSI Technology , 2024 IEEE Symposium on VLSI Technology and Circuits, VLSI Technology and Circuits 2024. (Digest of Technical Papers - Symposium on VLSI Technology, 2024)
Conference
Sarkar, T.; Radisic, D.; Gonzalez, V.V.; Stiers, K.; Sheng, C.; Montero, D.; Lazzarino, F.; Horiguchi, N.; Jenkins, H.; Wang, P.; Demand, M.
In: Proceedings of SPIE - The International Society for Optical Engineering , Advanced Etch Technology and Process Integration for Nanopatterning XIII. (Proceedings of SPIE - The International Society for Optical Engineering, 2024, 12958)
Academic Journal
Smith, J.; Balic, A.; Diack, A.B.; Gheyas, A.A.; Henderson, L.J.; McGrew, M.J.; Perini, F.; Stevens, M.P.; Vervelde, L.; Wu, Z.; Alfieri, J.M.; Athrey, G.N.; Blackmon, H.; Anthony, N.; Okimoto, R.; Arensburger, P.; Balacco, J.; Fedrigo, O.; Formenti, G.; Haase, B.; Jarvis, E.D.; Mountcastle, J.; Bardou, P.; Barela, P.; Casono, M.C.; Chiodi, M.; Cigan, L.; Das, N.; Davey, S.; Goodell, A.; Johnson, S.M.; Keroack, J.H.; McCarthy, F.M.; Potter, K.C.; Young, M.C.; Bigot, Y.; Borodin, P.M.; Torgasheva, A.A.; Carroll, R.; Charles, M.; Tixier-Boichard, M.; Cheng, H.; Coghill, L.M.; Stiers, K.; Crooijmans, R.; Derks, M.; Davidian, A.; Dyomin, A.; Gaginskaya, E.; Galkina, S.; Degalez, F.; Lagarrigue, S.; Dekkers, J.M.; Gallardo, R.A.; Kelly, T.; Lamont, S.J.; Saelao, P.; Wang, Y.; Zhou, H.; Wolc, A.; Djikeng, A.; Drechsler, Y.; Fiddaman, S.R.; Smith, A.; Frantz, L.A.F.; Ng'ang'a, I.; Fulton, J.E.; Geibel, J.; Reimer, C.; Schauer, J.; Weigend, S.; Simianer, H.; Godinez, C.J.P.; Graves, J.A.M.; Griffin, D.K.; O'Connor, R.E.; Han, J.-L.; Hanotte, O.; Hou, Z.-C.; Yin, Z.-T.; Howe, K.; Tracey, A.; Huynh, L.; Kaufman, J.; Rocos, N.; Ilatsia, E.; Muhonja, C.K.; Ouko, O.; Tregaskes, C.A.; Martin, R.J.; Kemp, S.; Ogugo, M.; Tiambo, C.K.; Kern, C.; Klopp, C.; Lange, M.; Lanke, A.; Larkin, D.M.; Larson, G.; Layos, J.K.N.; Lebrasseur, O.; Malinovskaya, L.P.; Cerezo, M.L.M.; Wright, D.; Mason, A.S.; Muir, W.; Muret, K.; Murphy, T.D.; Schneider, V.A.; Webb, D.; Nishibori, M.; Patel, H.R.; Pigozzi, M.I.; Price, P.D.; Wright, A.E.; Rice, E.S.; Warren, W.C.; Rogers, T.F.; Schnabel, R.D.; Waters, P.D.; Yamagata, M.; Yang, C.; Zhang, G.; Zhao, B.
In: Cytogenetic and Genome Research . (Cytogenetic and Genome Research, 1 July 2023, 162(8-9):405-528)
Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Conference
In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 , Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016, 21 February 2017, :107-110)
Conference
In: ECS Transactions , Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 6. (ECS Transactions, 2016, 72(4):145-152)
Conference
Halder, S.; Stiers, K.; Kandaswamy, P.K.; Rosmeulen, M.; Carbonell, L.; Saripalli, Y.; Osman, H.; Rosseel, E.; Mani, A.; Hu, Q.; Vedula, S.; Polli, M.
In: ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings , 2013 24th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2013. (ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings, 2013, :371-374)
Conference
Halder, S.; Stiers, K.; Miller, A.; De Wolf, I.; Phommahaxay, A.; Maenhoudt, M.; Beyne, E.; Guerrieri, S.
In: ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings , 2013 24th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2013. (ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings, 2013, :75-79)
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[AR] Stiers, K.
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