학술논문
'학술논문'
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1~10
Academic Journal
Kowalski, C.; Sibert, N.T.; Wesselmann, S.; Hammerer, P.; Feick, G.; Carl, E.-G.; Klotz, T.; Apel, H.; Dieng, S.; Nyarangi-Dix, J.; Knoll, T.; Reike, M.J.; Duwe, G.; Bartolf, E.; Steiner, T.; Borowitz, R.; Lümmen, G.; Seitz, A.K.; Pfitzenmaier, J.; Aziz, A.; Brock, M.; Berger, F.P.; Kaftan, B.T.; Grube, C.; Häfner, T.; Hamza, A.; Schmelz, H.; Haas, J.; Lenart, S.; Lafita, A.; Sippel, C.; Winter, A.; Kedia, G.; Hadaschik, B.; Varga, Z.; Buse, S.; Richter, M.; Distler, F.; Simon, J.; Wiegel, T.; Baltes, S.; Janitzky, A.; Sommer, J.P.; Hijazi, S.; Fülkell, P.; Harke, N.N.; Bolenz, C.; Khalil, C.; Breidenbach, C.; Tennstedt, P.; Burchardt, M.
In: Urologie . (Urologie, January 2024, 63(1):67-74)
Conference
Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Bottcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1453-1459 May, 2009
Conference
In: ISPCE 2023 - IEEE International Symposium on Product Compliance Engineering, Proceedings , ISPCE 2023 - IEEE International Symposium on Product Compliance Engineering, Proceedings. (ISPCE 2023 - IEEE International Symposium on Product Compliance Engineering, Proceedings, 2023)
Conference
2006 1st Electronic Systemintegration Technology Conference; 2006, p1088-1095, 8p
Conference
In: DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS , 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. (DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2009, :338-342)
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제한된 항목
[AR] Sommer, J.P.
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