학술논문
'학술논문'
에서 검색결과 29건 | 목록
1~10
Academic Journal
ISPRS International Journal of Geo-Information, Vol 11, Iss 3, p 176 (2022)
Academic Journal
Kwang Hong Lee; Yue Wang; Bing Wang; Li Zhang; Wardhana Aji Sasangka; Shuh Chin Goh; Shuyu Bao; Kenneth E. Lee; Eugene A. Fitzgerald; Chuan Seng Tan
IEEE Journal of the Electron Devices Society, Vol 6, Pp 571-578 (2018)
Academic Journal
Shuyu Bao; Daeik Kim; Chibuzo Onwukaeme; Shashank Gupta; Krishna Saraswat; Kwang Hong Lee; Yeji Kim; Dabin Min; Yongduck Jung; Haodong Qiu; Hong Wang; Eugene A. Fitzgerald; Chuan Seng Tan; Donguk Nam
Nature Communications, Vol 8, Iss 1, Pp 1-7 (2017)
Academic Journal
Yuye Kang; Yi-Chiau Huang; Kwang Hong Lee; Shuyu Bao; Wei Wang; Dian Lei; Saeid Masudy-Panah; Yuan Dong; Ying Wu; Shengqiang Xu; Chuan Seng Tan; Xiao Gong; Yee-Chia Yeo
AIP Advances, Vol 8, Iss 2, Pp 025111-025111-7 (2018)
Academic Journal
Kwang Hong Lee; Shuyu Bao; Bing Wang; Cong Wang; Soon Fatt Yoon; Jurgen Michel; Eugene A. Fitzgerald; Chuan Seng Tan
AIP Advances, Vol 6, Iss 2, Pp 025028-025028-7 (2016)
Academic Journal
APL Materials, Vol 3, Iss 1, Pp 016102-016102-7 (2015)
Academic Journal
Shuyu Bao; Yue Wang; Khaw Lina; Li Zhang; Bing Wang; Wardhana Aji Sasangka; Kenneth Eng Kian Lee; Soo Jin Chua; Jurgen Michel; Eugene Fitzgerald; Chuan Seng Tan; Kwang Hong Lee
半导体学报(英文版) / Journal of Semiconductors. 42(2):83-102
Academic Journal
Springer, Journal of Global Optimization. 85(1):15-38
Academic Journal
Conference
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on. :32-32 Jul, 2014
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제한된 항목
[AR] Shuyu Bao
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