학술논문

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발행년	- (예 : 2010-2015)

전체선택

3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and Beyond

Conference

Kim, D.-W.; Yu, L.H.; Chang, K.F.; Woon Leng, L.; Ser Choong, C.; Hong, C.; Bhattacharya, S.

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :834-840 May, 2018

Full Text (IEEE) Find it@PNU

Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications

Conference

Sekhar, V.N.; Kumar, M.D.; Ser Choong, C.; Rao, V.S.; Fujiwara, T.; Araki, H.; Shoji, Y.; Jukei, M.; Nomura, K.

In: Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023, 2023, :216-220)

Full Text (IEEE) Scopus Find it@PNU

Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning

Conference

Pahwa, R.S.; Chang, R.; Jie, W.; Xun, X.; Zaw Min, O.; Sheng, F.C.; Ser Choong, C.; Rao, V.S.

In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022. (Proceedings - Electronic Components and Technology Conference, 2022, 2022-May:1890-1897)

Full Text (IEEE) Scopus Find it@PNU

Development of Mold-First Fan-Out Panel-Level Packaging (FO-PLP) on 600mm x 600mm Size Panel

Conference

Srinivasa Rao, V.; Ser Choong, C.; Yamamoto, K.

In: Proceedings - Electronic Components and Technology Conference, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. (Proceedings - Electronic Components and Technology Conference, June 2020, 2020-June:1154-1160)

Full Text (IEEE) Scopus Find it@PNU

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