학술논문
'학술논문'
에서 검색결과 7건 | 목록
1~10
Conference
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K. -D.
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :82-87 May, 2016
Conference
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M. V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :836-843 May, 2011
Conference
Topper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jager, D.; Fetter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :74-80 2000
Academic Journal
Zoschke, K.; Fischer, T.; Topper, M.; Samulewicz, K.; Wunsch, O.; Roder, J.; Lutz, M.; Ehrmann, O.; Reichl, H.
IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 33(2):398-407 May, 2010
Conference
Topper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :198-200 2000
Academic Journal
Töepper, M.; Auersperg, J.; Glaw, V.; Coskina, P.; Jäeger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.; Kaskoun, K.; Prack, E.; Keser, B.
In: Proceedings - Electronic Components and Technology Conference . (Proceedings - Electronic Components and Technology Conference, 2000, :74-80)
Conference
Toepper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.
In: Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces . (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 2000, :198-200)
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제한된 항목
[AR] Samulewicz, K.
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