학술논문
'학술논문'
에서 검색결과 5건 | 목록
1~10
Conference
Proceedings of IEEE Electrical Performance of Electronic Packaging Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1993. :69-71 1993
Academic Journal
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 17(4):514-519 Nov, 1994
Academic Journal
Warnock, J.; Puri, R.; Jatkowski, A.; Datta, A.; Bansal, A.; Sigal, L.; Chan, Y.; Carey, S.; Malone, D.; Gattiker, A.; Mayer, G.; Chan, Y.-H.; Mayo, M.; Rude, D.L.; Strach, T.; Smith, H.H.; Mak, P.-K.; Shum, C.-L.K.; Plass, D.; Webb, C.; Harrer, H.; Salem, G.; Zitz, J.A.; Strevig, G.; Wen, H.
In: IEEE Journal of Solid-State Circuits , 0b00006481ea45e6. (IEEE Journal of Solid-State Circuits, January 2014, 49(1):9-18)
Academic Journal
Warnock, J.; Chan, Y.-H.; Carey, S.; Meaney, P.; Smith, H.H.; Chan, Y.; Davis, J.; Bunce, P.; Pelella, A.; Rodko, D.; Patel, P.; Malone, D.; Malgioglio, F.; Neves, J.; Rude, D.L.; Huott, W.; Wen, H.; Gerwig, G.; Strach, T.
In: IEEE Journal of Solid-State Circuits , SPECIAL ISSUE ON THE 2011 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE. (IEEE Journal of Solid-State Circuits, January 2012, 47(1):151-163)
Academic Journal
Warnock, J.; Chan, Y.-H.; Carey, S.; Wen, H.; Meaney, P.; Gerwig, G.; Smith, H.H.; Chan, Y.; Davis, J.; Bunce, P.; Pelella, A.; Rodko, D.; Patel, P.; Strach, T.; Malone, D.; Malgioglio, F.; Neves, J.; Rude, D.L.; Huott, W.
In: IEEE Journal of Solid-State Circuits . (IEEE Journal of Solid-State Circuits, In Press, 31 October 2011)
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제한된 항목
[AR] Rude, D.L.
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