학술논문
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Conference
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :277-282 May, 2023
Reliability Challenges of High-Density Fan-out Packaging for High-Performance Computing Applications
Conference
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1454-1458 May, 2022
Conference
Yu, C.K.; Chiang, W.S.; Huang, P.S.; Lin, M.Z.; Fang, Y.H.; Lin, M.J.; Peng, Cooper; Lin, Benson; Huang, Michael
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1623-1627 May, 2018
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[AR] Peng, Cooper
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