학술논문
'학술논문'
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Conference
Dudek, R.; Hildebrandt, M.; Kreysig, K.; Rzepka, S.; Doring, R.; Scheiter, L.; Zhang, M.; Ortmann, R. W.
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020 21st International Conference on. :1-8 Jul, 2020
Conference
Dudek, R.; Hildebrandt, M.; Kreysig, K.; Rzepka, S.; Doring, R.; Seiler, B.; Fries, Th.; Zhang, M.; Ortmann, R. W.
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :173-179 Dec, 2018
Conference
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Doring, R.; Scheiter, L.; Seiler, B.; Fries, Th.; Ortmann, R. W.
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017 18th International Conference on. :1-9 Apr, 2017
Academic Journal
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[AR] Ortmann, R. W.
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