학술논문
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Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation
Conference
2008 2nd Electronics System-Integration Technology Conference Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. :829-832 Sep, 2008
Conference
2008 2nd Electronics System-Integration Technology Conference Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd. :1219-1224 Sep, 2008
Conference
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International. :14-19 Oct, 2007
Conference
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International. :165-171 Oct, 2007
Academic Journal
Academic Journal
Marks, A. E.; Demidenko, Yu. E.; Monigal, K.; Usik, V. I.; Ferring, C. R.; Burke, A.; Rink, J.; McKinney, C.
Academic Journal
Journal of Materials Engineering and Performance. February 2010 19(1):40-45
Academic Journal
Academic Journal
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제한된 항목
[AR] Marks, A. E.
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