학술논문
'학술논문'
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Conference
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024
Conference
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024
Academic Journal
Chastand, Victor; Tezenas, Astrid; Cadoret, Yannick; Quaegebeur, Philippe; Maia, Wilson; Charkaluk, Eric
In Procedia Structural Integrity 2016 2:3168-3176
Conference
Vieilledent, Julien; Maia, Wilson; Retailleau, Pascal; Ameil-Ferbos, Marie Gabrielle; Dulondel, Frederic; Milesi, Philippe; Munier, Catherine; Jephos, Catherine
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-7 Sep, 2019
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Conference
Macurova, Katerina; Angerer, Paul; Schongrundner, Ronald; Krivec, Thomas; Morianz, Mike; Antretter, Thomas; Bermejo, Raul; Pletz, Martin; Brizoux, Michel; Maia, Wilson
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on. :1-7 Apr, 2014
Conference
Macurova, Katerina; Kharicha, Abdellah; Pletz, Martin; Mataln, Marianne; Bermejo, Raul; Schongrundner, Ronald; Krivec, Thomas; Antretter, Thomas; Maia, Wilson; Morianz, Mike; Brizoux, Michel
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-6 Apr, 2013
Academic Journal
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[AR] Maia, Wilson
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