학술논문
'학술논문'
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Academic Journal
IEEE Letters on Electromagnetic Compatibility Practice and Applications IEEE Lett. on Electromagn. Compat. Pract. and Appl. Electromagnetic Compatibility Practice and Applications, IEEE Letters on. 5(2):37-40 Jun, 2023
Academic Journal
In: Journal of Power Sources . (Journal of Power Sources, 1 October 2024, 616)
Academic Journal
In: Energy Storage Materials . (Energy Storage Materials, February 2024, 65)
Academic Journal
In: Electrochimica Acta . (Electrochimica Acta, 20 September 2023, 463)
Academic Journal
Pascart, T.; Pacaud, A.; Grandjean, A.; Rabin, T.; Ducoulombier, V.; Houvenagel, E.; Robinet, P.; Visade, F.; Mackowiak, A.; Maréchaux, S.; Lefebvre, A.; Budzik, J.-F.; Ottaviani, S.; Leroy, R.; Segaud, N.; Luraschi, H.; Deplanque, X.; Maciejasz, P.; Baclet, N.; Bardin, T.; Richette, P.; Norberciak, L.
In: The Lancet Rheumatology . (The Lancet Rheumatology, September 2023, 5(9):e523-e531)
Academic Journal
Maćkowiak, A.; Bugała, A.; Bugała, D.; Jajczyk, J.; Kostrzewski, M.; Chamier-Gliszczyński, N.; Woźniak, W.; Dombek, G.; Nowak, K.
In: Eksploatacja i Niezawodnosc . (Eksploatacja i Niezawodnosc, 2023, 25(4))
Academic Journal
In: Cells . (Cells, October 2022, 11(19))
Academic Journal
Pascart, T.; Robinet, P.; Ottaviani, S.; Leroy, R.; Segaud, N.; Pacaud, A.; Grandjean, A.; Luraschi, H.; Rabin, T.; Deplanque, X.; Maciejasz, P.; Visade, F.; Mackowiak, A.; Baclet, N.; Lefebvre, A.; Budzik, J.F.; Bardin, T.; Richette, P.; Norberciak, L.; Ducoulombier, V.; Houvenagel, E.
In Revue du rhumatisme December 2022 89 Supplement 1:A19-A19
Conference
In: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings , 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings. (2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal and Power Integrity: EMC Japan/Asia Pacific International Symposium on Electromagnetic Compatibility, EMC Japan/APEMC Okinawa 2024 - Proceedings, 2024, :296-299)
Academic Journal
Chiku, M.; Abdollahifar, M.; Brousse, T.; Crosnier, O.; Chen, G.Z.; Dunn, B.; Fic, K.; Jeżowski, P.; Maćkowiak, A.; Hu, C.-C.; Naoi, K.; Okita, N.; Ogihara, N.; Okubo, M.; Sugimoto, W.; Wu, N.-L.
In: Electrochemistry . (Electrochemistry, 2024, 92(7))
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[AR] Mackowiak, A.
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