학술논문
'학술논문'
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Academic Journal
In Microelectronics Reliability February 2022 129
Conference
Yang, Channing Cheng-Lin; Lau, John H; Peng, Andy Yan-Jia; Teng, Vincent; Chen, Gary Chang-Fu; Huang, Jones Yu-Cheng; Chen, YH; Liu, Hsing-Ning; Tseng, Tzyy-Jang; Li, Ming
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :542-547 May, 2023
Conference
Chen, Gary Chang-Fu; Lau, John H; Yang, Channing Cheng-Lin; Huang, Jones Yu-Cheng; Peng, Andy Yan-Jia; Liu, Hsing-Ning; Tseng, Tzyy-Jang; Li, Ming
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :30-37 May, 2022
Academic Journal
Lee, Chang-Chun; Cheng, Ren-Chin; Lin, Yu-Min; Liu, Hsing-Ning; Liou, Yan-Yu; Chang, Tao-Chih; Wang, Chien-Ping
In Microelectronic Engineering 20 April 2016 156:30-36
Conference
Lau, John H; Chen, Gary Chang-Fu; Huang, Jones Yu-Cheng; Chou, Ricky Tsun-Sheng; Yang, Channing Cheng-Lin; Liu, Hsing-Ning; Tseng, Tzvy-Jang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :148-156 Jun, 2021
Conference
Lau, John H; Ko, Cheng-Ta; Peng, Chia-Yu; Yang, Kai-Ming; Xia, Tim; Lin, Puru Bruce; Chen, Jean-Jou; Huang, Po-Chun; Tseng, Tzvy-Jang; Lin, Eagle; Chang, Leo; Lin, Curry; Fan, Yan-Jun; Liu, Hsing-Ning; Lu, Winnie
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :359-364 Jun, 2021
Academic Journal
Lau, John H.; Chen, Gary Chang-Fu; Yang, Channing Cheng-Lin; Teng, Vincent; Peng, Andy Yan-Jia; Huang, Jones Yu-Cheng; Liu, Hsing-Ning; Chen, Y. H.; Tseng, Tzyy-Jang; Li, Ming
Periodical
Lau, John H.; Lin, Curry; Liu, Hsing-Ning; Yang, Kai-Ming; Xia, Tim; Ko, Cheng-Ta; Lin, Bruce Puru; Chuang, Yu-Ling; Chen, R.; Ma, M.; Tseng, Tzyy-Jang; Li, Ming; Leung, K.
Components, Packaging, and Manufacturing Technology, IEEE Transactions on; September 2023, Vol. 13 Issue: 9 p1371-1379, 9p
Academic Journal
Peng, Tony Chia-Yu; Lau, John H.; Ko, Cheng-Ta; Lee, Paul; Lin, Eagle; Yang, Kai-Ming; Lin, Bruce Puru; Xia, Tim; Chang, Leo; Liu, Hsing-Ning; Lin, Curry; Lee, Tzu Nien; Wong, Jason; Ma, Mike; Tseng, Tzyy-Jang
Academic Journal
Lau, John H.; Chen, Gary Chang-Fu; Huang, Jones Yu-Cheng; Chou, Ricky Tsun-Sheng; Yang, Channing Cheng-Lin; Liu, Hsing-Ning; Tseng, Tzyy-Jang
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[AR] Liu, Hsing-Ning
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