학술논문
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Conference
Wu, Shien-Yang; Chang, C.H.; Chiang, M.C.; Lin, C.Y.; Liaw, J.J.; Cheng, J.Y.; Yeh, J.Y.; Chen, H.F.; Chang, S.Y.; Lai, K.T.; Liang, M.S.; Pan, K.H.; Chen, J.H.; Chang, V.S.; Luo, T.C.; Wang, X.; Mor, Y.S.; Lin, C.I.; Wang, S.H.; Hsieh, M.Y.; Chen, C.Y.; Wu, B.F.; Lin, C.J.; Liang, C.S.; Tsao, C.P.; Li, C.T.; Chen, C.H.; Hsieh, C.H.; Liu, H.H.; Chen, P.N.; Chen, C.C.; Chen, R.; Yeo, Y.C.; Chui, C.O.; Chang, W.; Lee, T.L.; Huang, K.B.; Lin, H.J.; Chen, K.W.; Tsai, M.H.; Chen, K.S.; Chen, X.M.; Cheng, Y.K.; Wang, C.H.; Shue, W.; Ku, Y.; Jang, S. M.; Cao, M.; Lu, L.C.; Chang, T.S.
2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :27.5.1-27.5.4 Dec, 2022
Academic Journal
Lu, H.; Fisher, M.; Selim, M.; Shehadah, A.; Ashiqueali, R.; Lin, C.I.; Walchale, A.; Clendaniel, V.; Matheson, R.; Lo, E.H.
In: Molecular Neurobiology . (Molecular Neurobiology, January 2023, 60(1):235-246)
Academic Journal
In Materials Science in Semiconductor Processing 2010 13(3):189-192
Academic Journal
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science . (Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, June 2021, 52(6):2149-2154)
Academic Journal
In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science . (Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, 1 March 2020, 51(3):1353-1366)
Conference
Shien-Yang Wu; Liaw, J.J.; Lin, C.Y.; Chiang, M.C.; Yang, C.K.; Cheng, J.Y.; Tsai, M.H.; Liu, M.Y.; Wu, P.H.; Chang, C.H.; Hu, L.C.; Lin, C.I.; Chen, H.F.; Chang, S.Y.; Wang, S.H.; Tong, P.Y.; Hsieh, Y.L.; Pan, K.H.; Hsieh, C.H.; Chen, C.H.; Yao, C.H.; Chen, C.C.; Lee, T.L.; Chang, C.W.; Lin, H.J.; Chen, S.C.; Shieh, J.H.; Jang, S.M.; Chen, K.S.; Ku, Y.; See, Y.C; Lo, W.J.
2009 Symposium on VLSI Technology VLSI Technology, 2009 Symposium on. :210-211 Jun, 2009
Conference
Wu, Shien-Yang; Chou, C.W.; Lin, C.Y.; Chiang, M.C.; Yang, C.K.; Liu, M.Y.; Hu, L.C.; Chang, C.H.; Wu, P.H.; Lin, C.I.; Chen, H.F.; Chang, S.Y.; Wang, S.H.; Tong, P.Y.; Hsieh, Y.L.; Liaw, J.J.; Pan, K.H.; Hsieh, C.H.; Chen, C.H.; Cheng, J.Y.; Yao, C.H.; Wan, W.K.; Lee, T.L.; Huang, K.T.; Chen, C.C; Lin, K.C.; Yeh, L.Y.; Ku, K.C.; Chen, S.C.; Chang, C.W.; Lin, H.J.; Jang, S.M.; Lu, Y.C.; Shieh, J.H.; Tsai, M.H.; Song, J.Y.; Chen, K.S.; Chang, V.; Cheng, S.M.; Yang, S.H.; Diaz, C.H.; See, Y.C.; Liang, M.S.
2007 IEEE International Electron Devices Meeting Electron Devices Meeting, 2007. IEDM 2007. IEEE International. :263-266 Dec, 2007
Academic Journal
Conference
In: IEEE International Reliability Physics Symposium Proceedings , 2022 IEEE International Reliability Physics Symposium, IRPS 2022 - Proceedings. (IEEE International Reliability Physics Symposium Proceedings, 2022, 2022-March:8C31-8C37)
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[AR] Lin, C.I.
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