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A CMP Process for Hybrid Bonding Application with Conventional / nt-Cu and SixNy / SixOy Dielectrics
Conference
2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2058-2061 May, 2024
Academic Journal
Wijanarko, M.G.; Widagdo, A.J.; Ismadji, M.S.; Kusuma, K.; Yuliana, M.; Ismadji, S.; Hartono, S.B.; Lie, J.; Shu, H.; Abdullah, H.; Kadja, G.T.M.; Wijaya, C.J.; Soetaredjo, F.E.
In Materials Today Sustainability March 2023 21
Academic Journal
In: Chemical Engineering and Processing - Process Intensification . (Chemical Engineering and Processing - Process Intensification, June 2024, 200)
Academic Journal
In: Journal of the Taiwan Institute of Chemical Engineers . (Journal of the Taiwan Institute of Chemical Engineers, June 2024, 159)
Academic Journal
In: Journal of the Taiwan Institute of Chemical Engineers . (Journal of the Taiwan Institute of Chemical Engineers, February 2024, 155)
Academic Journal
Gunarto, C.; Lie, J.; Soetaredjo, F.E.; Ismadji, S.; Puspitasari, N.; Putro, J.N.; Risdian, C.; Go, A.W.; Angkawijaya, A.E.
In: Indonesian Journal of Chemistry . (Indonesian Journal of Chemistry, 2024, 24(3):900-977)
Academic Journal
In: Pakistan Journal of Botany . (Pakistan Journal of Botany, 2024, 56(1):27-34)
Academic Journal
In: Materials Science and Engineering: B . (Materials Science and Engineering: B, January 2024, 299)
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제한된 항목
[AR] Lie, J.
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