학술논문
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Board Level Reliability Study of Next Generation Large Die Wafer Level Chip Scale Package Structures
Conference
2018 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2018 International. :1-9 Oct, 2018
Academic Journal
Academic Journal
International Journal of Sports Marketing and Sponsorship, 2019, Vol. 21, Issue 1, pp. 70-90.
Periodical
International Journal of Sports Marketing & Sponsorship; October 2019, Vol. 21 Issue: 1 p70-90, 21p
Academic Journal
Academic Journal
Academic Journal
Academic Journal
European Sport Management Quarterly; Jun2012, Vol. 12 Issue 3, p291-308, 18p, 5 Charts
Academic Journal
Periodical
Daprano, CorinneM.; Bruening, JenniferE.; Pastore, DonnaL.; Greenwell, T.Christopher; Dixon, MarleneA.; Ko, YongJae; Jordan, JeremyS.; Lilienthal, SonjaK.; Turner, BrianA.
Quest: National Association for Physical Education in Higher Education; August 2005, Vol. 57 Issue: 3 p300-314, 15p
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제한된 항목
[AR] Ko, YongJae
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