학술논문
'학술논문'
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Academic Journal
In Microelectronics Reliability November 2020 114
Academic Journal
In Organic Electronics May 2015 20:69-75
Academic Journal
Klengel, R.; Klengel, S.; Tismer, S.; Araki, N.; Eto, M.; Haibara, T.; Yamada, T.; Feldmann, J.; Scheer, A.; Binner, R.; Peters, H.
In: Advancing Microelectronics . (Advancing Microelectronics, September 2023, 2023(EMPC):195-200)
Conference
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :2163-2168 May, 2016
Conference
2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :2157-2162 May, 2016
Conference
In: ETG-Fachbericht , CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems. (ETG-Fachbericht, 2024, 173:526-531)
Conference
2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-6 Sep, 2013
Conference
2012 4th Electronic System-Integration Technology Conference Electronic System-Integration Technology Conference (ESTC), 2012 4th. :1-5 Sep, 2012
Conference
18th European Microelectronics & Packaging Conference Microelectronics and Packaging Conference (EMPC), 2011 18th European. :1-5 Sep, 2011
Conference
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 12th IEEE Intersociety Conference on. :1-4 Jun, 2010
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[AR] Klengel, R.
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