학술논문
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Conference
Muller, J.; Pfefferling, B.; Merbeth, T.; Otani, Y.; Hazen, D. Sanchez; Hula, T.; Mansueto, M.; Titova, A.; Ramasubramanian, L.; Grimm, C. V.-B.; Weisheit, M.; Wolf, G.; Kriegerstein, V.; Vogel, A.; Scharf, P.; Wang, Y.; Huang, Y.; Komma, V. S.; Sankar, R. Uma; Yoon, H.; Kallensee, O.; Naik, V. B.; Soss, S.
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024
Conference
Naik, V. B.; Yamane, K.; Kwon, J.; Lim, J.H.; Balasankaran, N.; Chung, N.L.; Hau, L.Y.; Chao, R.; Chiang, C.; Huang, Y.; Pu, L.; Ma, L.; Meng, C.; Otani, Y.; Zhang, L.; Jang, S.H.; Ling, T.; Ting, J.W.; Yoon, H.; Mueller, J.; Pfefferling, B.; Kallensee, O.; Merbeth, T.; Seet, C.S.; Wong, J.; You, Y.S.; Soss, S.; Chan, T.H.; Siah, S.Y.
2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :366-368 Mar, 2022
Conference
Naik, V. B.; Lim, J. H.; Yamane, K.; Kwon, J.; B., Behin-Aein; Chung, N. L.; K, S.; Hau, L. Y.; Chao, R.; Chiang, C.; Huang, Y.; Pu, L.; Otani, Y.; Jang, S.H.; Balasankaran, N.; Neo, W. P.; Ling, T.; Ting, J. W.; Yoon, H.; Mueller, J.; Pfefferling, B.; Kallensee, O.; Merbeth, T.; Seet, C.S.; Wong, J.; You, Y. S.; Soss, S.; Chan, T. H.; Siah, S. Y.
2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :6B.3-1-6B.3-6 Mar, 2022
Conference
Naik, V. B.; Yamane, K.; Kwon, J.; K, S.; Lim, J. H.; Ali, Z.; Behin-Aein, B.; Chung, N. L.; Hau, L. Y.; Chao, R.; Chiang, C.; Huang, Y.; Pu, L.; Otani, Y.; Dixit, H.; Jang, S. H.; Balasankaran, N.; Tan, F.; Neo, W. P.; Goh, L. C.; Toh, E. H.; Ling, T.; Ting, J. W.; Yoon, H.; Congedo, G.; Mueller, J.; Pfefferling, B.; Kallensee, O.; Vogel, A.; Merbeth, T.; Seet, C. S.; Wong, J.; Bordelon, J.; You, Y. S.; Soss, S.; Chan, T. H.; Quek, E.; Siah, S. Y.
2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
Conference
Naik, V. B.; Yamane, K.; Lee, T.Y.; Kwon, J.; Chao, R.; Lim, J.H.; Chung, N.L.; Behin-Aein, B.; Hau, L.Y.; Zeng, D.; Otani, Y.; Chiang, C.; Huang, Y.; Pu, L.; Jang, S.H.; Neo, W.P.; Dixit, H.; Goh, S. K L. C.; Toh, E. H.; Ling, T.; Hwang, J.; Ting, J.W.; Low, R.; Zhang, L.; Lee, C.G.; Balasankaran, N.; Tan, F.; Gan, K. W.; Yoon, H.; Congedo, G.; Mueller, J.; Pfefferling, B.; Kallensee, O.; Vogel, A.; Kriegerstein, V.; Merbeth, T.; Seet, C.S.; Ong, S.; Xu, J.; Wong, J.; You, Y.S.; Woo, S.T.; Chan, T.H.; Quek, E.; Siah, S. Y.
2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :11.3.1-11.3.4 Dec, 2020
Conference
Naik, V. B.; Lee, K.; Yamane, K.; Chao, R.; Kwon, J.; Thiyagarajah, N.; Chung, N. L.; Jang, S. H.; Behin-Aein, B.; Lim, J. H.; Lee, T. Y.; Neo, W. P.; Dixit, H.; K, S.; Goh, L. C.; Ling, T.; Hwang, J.; Zeng, D.; Ting, J. W.; Toh, E. H.; Zhang, L.; Low, R.; Balasankaran, N.; Zhang, L. Y.; Gan, K. W.; Hau, L. Y.; Mueller, J.; Pfefferling, B.; Kallensee, O.; Tan, S. L.; Seet, C. S.; You, Y. S.; Woo, S. T.; Quek, E.; Siah, S. Y.; Pellerin, J.
2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :2.3.1-2.3.4 Dec, 2019
Conference
Muller, J.; Titova, A.; Yoon, H.; Merbeth, T.; Weisheit, M.; Wolf, G.; Bharali, S.; Pfefferling, B.; Otani, Y.; Grimm, C.V.-B.; Krause, F.; Altendorf, I.; Congedo, G.; Binder, R.; Metzger, J.; Lajn, A.; Langner, M.; You, Y.S.; Kallensee, O.; Naik, V.B.; Yamane, K.; Soss, S.; Shapoval, T.; Cagliani, A.; Vajda, F.; Sadeghi, P.
In: 2022 IEEE International Memory Workshop, IMW 2022 - Proceedings , 2022 IEEE International Memory Workshop, IMW 2022 - Proceedings. (2022 IEEE International Memory Workshop, IMW 2022 - Proceedings, 2022)
Conference
Naik, V.B.; Yamane, K.; Kwon, J.; Lim, S.K.J.H.; Ali, Z.; Behin-Aein, B.; Chung, N.L.; Hau, L.Y.; Chao, R.; Chiang, C.; Huang, Y.; Pu, L.; Otani, Y.; Dixit, H.; Jang, S.H.; Balasankaran, N.; Tan, F.; Neo, W.P.; Goh, L.C.; Toh, E.H.; Ling, T.; Ting, J.W.; Yoon, H.; Congedo, G.; Mueller, J.; Pfefferling, B.; Kallensee, O.; Vogel, A.; Merbeth, T.; Seet, C.S.; Wong, J.; Bordelon, J.; You, Y.S.; Soss, S.; Chan, T.H.; Quek, E.; Siah, S.Y.
In: Digest of Technical Papers - Symposium on VLSI Technology , 2021 Symposium on VLSI Technology, VLSI Technology 2021. (Digest of Technical Papers - Symposium on VLSI Technology, 2021, 2021-June)
Conference
Conference
Hoentschel, J.; Ong, S.Y.; Balzer, T.; Sassiat, N.; Yan, R.; Herrmann, T.; Flachowsky, S.; Grass, C.; Beyer, S.; Kallensee, O.; Lin, Y.-Y.; Shickova, A.; Muehlhoff, A.; Kretzschmar, C.; Winkler, J.; Wiatr, M.; Horstmann, M.
In: ULIS 2013: The 14th International Conference on Ultimate Integration on Silicon, Incorporating the 'Technology Briefing Day' , ULIS 2013: The 14th International Conference on Ultimate Integration on Silicon, Incorporating the 'Technology Briefing Day'. (ULIS 2013: The 14th International Conference on Ultimate Integration on Silicon, Incorporating the 'Technology Briefing Day', 2013, :37-40)
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[AR] Kallensee, O.
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