학술논문
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Academic Journal
In Solid State Electronics October 2013 88:27-31
Conference
Flachowsky, S.; Herrmann, T.; Hontschel, J.; Illgen, R.; Ong, Shiang Yang; Wiatr, M.; Baldauf, T.; Klix, W.; Stenzel, R.
2012 13th International Conference on Ultimate Integration on Silicon (ULIS) Ultimate Integration on Silicon (ULIS), 2012 13th International Conference on. :5-8 Mar, 2012
Conference
Baldauf, T.; Wei, A.; Herrmann, T.; Flachowsky, S.; Illgen, R.; Hontschel, J.; Horstmann, M.; Klix, W.; Stenzel, R.
2011 Semiconductor Conference Dresden Semiconductor Conference Dresden (SCD), 2011. :1-4 Sep, 2011
Conference
Baldauf, T.; Wei, A.; Illgen, R.; Flachowsky, S.; Herrmann, T.; Feudel, T.; Hontschel, J.; Horstmann, M.; Klix, W.; Stenzel, R.
Ulis 2011 Ultimate Integration on Silicon Ultimate Integration on Silicon (ULIS), 2011 12th International Conference on. :1-4 Mar, 2011
Conference
Dunkel, S.; Trentzsch, M.; Richter, R.; Moll, P.; Fuchs, C.; Gehring, O.; Majer, M.; Wittek, S.; Muller, B.; Melde, T.; Mulaosmanovic, H.; Slesazeck, S.; Muller, S.; Ocker, J.; Noack, M.; Lohr, D.-A.; Polakowski, P.; Muller, J.; Mikolajick, T.; Hontschel, J.; Rice, B.; Pellerin, J.; Beyer, S.
2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :19.7.1-19.7.4 Dec, 2017
Conference
Su, L.T.; Pellerin, J.; Huang, S.F.; Khare, M.; Schepis, D.; Rim, K.; Liming, S.; Waite, A.; Sato, T.; Panda, S.; Nii, H.; Lee, W.; Holt, J.; Fried, D.; Chidambarrao, D.; Chen, H.; Kepler, N.; Raab, M.; Greenlaw, D.; Stephan, R.; Hubler, P.; Ruelke, H.; Herzog, O.; Engelmann, H.-J.; Schaller, M.; Salz, H.; Trui, B.; Trentsch, M.; Reichel, C.; Press, P.; Otterbach, R.; Neu, A.; Lenski, M.; Koerner, G.; Klais, J.; Javorka, P.; Hohage, J.; Hempel, K.; Hellmich, A.; Gerhardt, M.; Frohberg, K.; Feudel, T.; Bierstedt, H.; Hontschel, J.; Kammler, T.; Wei, A.; Horstmann, M.
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest. International Electron Devices Meeting 2005 Electron Devices Meeting, 2005. IEDM Technical Digest. IEEE International. :233-236 2005
Conference
2003 International Symposium on Compound Semiconductors: Post-Conference Proceedings (IEEE Cat. No.03TH8767) Compound semiconductors Compound Semiconductors: Post-Conference Proceedings, 2003 International Symposium on. :114-117 2003
Academic Journal
Flachowsky, S.; Wei, A.; Illgen, R.; Herrmann, T.; Höntschel, J.; Horstmann, M.; Klix, W.; Stenzel, R.
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 57(6):1343-1354 Jun, 2010
Academic Journal
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 51(5):684-692 May, 2004
Conference
Flachowsky, S.; Hontschel, J.; Wei, A.; Illgen, R.; Hermann, P.; Herrmann, T.; Klix, W.; Stenzel, R.; Ramirez, A.; Horstmann, M.; Kernevez, N.; Cayrefourcq, I.; Metral, F.; Kennard, M.; Guiot, E.
2009 10th International Conference on Ultimate Integration of Silicon Ultimate Integration of Silicon, 2009. ULIS 2009. 10th International Conference on. :161-164 Mar, 2009
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[AR] Hontschel, J.
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