학술논문
'학술논문'
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1~10
Conference
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-9 Apr, 2018
Conference
2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-6 Jun, 2009
Periodical
Groß, S.; Grübl, W.; Schuch, B.; Stahr, H.; Morianz, M.; Böttcher, L; Manessis, D.; Nicolics, J.; Unger, M.
Ingénieurs de l'Automobile; sep2017, Issue 849, p75-80, 6p
Academic Journal
In: Journal of Electronic Materials . (Journal of Electronic Materials, 2013, 42(3):558-595)
Conference
In: Proceedings - Electronic Components and Technology Conference , Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018. (Proceedings - Electronic Components and Technology Conference, 7 August 2018, 2018-May:1233-1237)
Conference
In: EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition , EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition. (EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition, 2 July 2017, 2018-January:1-4)
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제한된 항목
[AR] Grübl, W.
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